(For the latest achievements in FaStack technology, see the Press links at the
bottom of this page.)
Tezzaron's groundbreaking FaStack technology creates fast, dense, highly integrated
3D chips. The heart of the process is wafer-level stacking. Device circuitry is divided
into sections that are built onto separate wafers using standard processing. The wafers
are then post-processed for thru-silicon interconnection, creating hundreds of thousands
of vertical "Super-Via™" connectors. The wafers are aligned with a precision
of 0.5 micron, then bonded, thinned, and diced into individual devices.
A Superior Technology
Before FaStack, 3D IC technologies suffered from thermal stress. FaStack solves this
problem by ultra-thinning the wafers to prevent thermal build-up; the copper used in the
bonding process provides additional thermal relief.
FaStack devices have many advantages over their single-layer counterparts. They are
much more dense and their short vertical interconnects allow them to operate at higher
speeds with a lower power budget. In addition, FaStack allows disparate elements to be
processed on separate wafers for simpler production and greater optimization.
Unlike the separate chips in a "System-in-Package" (SiP) component, FaStack
layers are fully integrated into a single IC by a dense system of through-silicon
interconnects. FaStack devices match the tight integration of SoC devices while out-doing
SiPs for high speed, low power budget, and tiny footprint.
FaStack’s wafer stacking offers benefits to a variety of applications. Sensor arrays,
for example, achieve unprecedented density by moving the support circuitry to a different
layer than the sensors themselves. “System-on-Chip” (SoC) devices built with FaStack reduce
power consumption, footprint, and interconnect delays. Microprocessors built with FaStack
incorporate a huge, fast memory cache on a separate layer. FaStack also enables enormous
improvements in memory technology and allows
seamless integration of differing substrates. As 3D processing moves into the mainstream,
entirely new products will emerge to capitalize on this technology.
Wafer Stacked SOC (example): Fast, Dense, with Mixed Substrates
Getting the FaStack® Advantage
Tezzaron seeks technology partners and systems designers ready to participate in the 3D
revolution with the proven benefits of FaStack wafer stacking. We are ready to license
the production technology so manufacturers can offer it to their customers, and we are
producing a series of FaStack-based products for end users, beginning with the
TSCR8051Lx microcontroller series.
Contact Tezzaron to discuss how you can become an
early partner or customer.
